Polymaker CoPA 6/6-6 1.75mm

PolyMide™ CoPA is a copolymer of Nylon 6 and Nylon 6,6 combining high tensile strength properties from Nylon 6 with heat resistance properties from Nylon 6.6. Warp-Free™ technology provides ease of printing by slowing down the crystallization allowing CoPA to be easily printed on open bed printers. Displaying outstanding mechanical and thermal properties, CoPA is suited for parts in demanding environments.

WHAT IS THE DIFFERENCE BETWEEN POLYLITE COSPLA VERSION A AND B?

After a couple of formula iteration, we developed a PolyLite™ CosPLA which was able to outperform the durability of regular PLA while being much easier to sand and paint. However, we found a way to improve the sand-ability even more and another way to almost double the toughness of the material. Unfortunately, we could not implement both technology at the same time, therefore we decided to go ahead and release two version:

Version A with the first technology improvement to enhance the sand-ability even more.

Version B with the second technology improvement to enhance the durability even more.

It is important to note that BOTH displays better durability and sand-ability than regular PLA while being easier to paint.

WHAT IS THE SHRINKAGE RATE OF POLYMIDE™ COPA?

The shrinkage rate depends on the print model size and infill setting.

DO YOU NEED TO ANNEAL POLYMIDE™ COPA?

PolyMide™ CoPA displays outstanding mechanical and thermal properties when fully crystallized. The printed part will not reach full crystallization after the printing process, an additional step is required: Annealing.

You can anneal PolyMide™ CoPA by placing your part in the oven at 80_C for 6h.

DOES POLYMIDE™ COPA REQUIRES AN ENCLOSED PRINTER?

No, all our Nylon features our Warp-Free Technology which means it does not require a heated bed or heated chamber of more than 50_C.

PolyMide™ CoPA can be printed on a 30-40_C bed without enclosure.

RECOMMENDED PRINTING CONDITIONS:

• Nozzle temperature - 250 - 270 (°C)
• Build Surface Material - PA film, PI film
• Build surface treatment - Applying PVA glue to the build surface
• Build plate temperature - 25 - 50 (°C)
• Cooling fan Turned - Off
• Printing speed - 30 - 50 (mm/s)
• Raft separation distance - 0.1 - 0.2 (mm)
• Retraction distance - 3-6 (mm)
• Retraction speed - 40 - 60 (mm/s)
• Recommended environmental temperature - 40 - 60 (°C)
• Threshold overhang angle - 55 (°)
• Recommended support material PolyDissolve™ S1

Based on 0.4 mm nozzle and Simplify 3D v.3.1. Printing conditions may vary with different nozzle diameters.

Note:

• Abrasion of the brass nozzle happens quite often when printing PolyMide™ CoPA. A wear-resistant nozzle, such as hardened steel and ruby nozzle, is highly recommended to be used with PolyMide™ CoPA.
• PolyMide™ CoPA is sensitive to moisture and should always be stored and used under dry conditions (relative humidity below 20%).
• If PolyMide™ CoPA is used as the support material for itself, please remove the support structure before excessive moisture absorption.
• Otherwise the support structure can be permanently bonded to the model.
• After the printing process, it is recommended to anneal the model in the oven at 70°C for 2 hours.

Making 3D Possible!

• PolyMide_ CoPA_TDS_V4.1
• PolyMide_CoPA_PIS_EN_V1